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fishbone·Ishikawa 1968 / ISO 9001 CAPA·manufacturing, quality·complexity 3/3·since v0.1.0

Manufacturing defect 6M fishbone

Ishikawa 6M root-cause analysis for a solder joint defect spike on an electronics assembly line.

For the quality engineer

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fishbone·§ Ishikawa 1968
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Solder Joint Defect Spike — Fishbone diagram Ishikawa cause-and-effect diagram. Effect: 3.2% solder joint rejects. 6 categories. Solder Joint Defect Spike 3.2% solder joint rejects Man New operators on night shift Training checklist not signed Handover notes incomplete Material Solder paste past floor life PCB pads oxidized after storage Measurement AOI false accept rate rising X-ray sampling reduced Machine Reflow oven zone 4 drift Thermocouple calibration overdue Stencil printer squeegee worn Method Stencil aperture undersized Pick-and-place speed raised Environment Humidity above process window ESD straps failing audit
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Scenario

An electronics manufacturer opens a CAPA after solder rejects spike above the control limit. The 6M fishbone forces the team to inspect people, machines, material, method, measurement, and environment before committing to corrective action.

Annotation key

Fishbone syntax